49% (10) 2.0k views 2 pages

FX5UJ CPU Module Packaging Change Notice

AI-enhanced description

This technical bulletin announces a packaging change for Mitsubishi Electric MELSEC iQ-F series FX5UJ CPU modules, effective February 2023. The change replaces molded pulp buffer materials and polyethylene bags with cardboard buffers to reduce environmental burden, with no impact on product specifications or dimensions.

Uploaded by alessia-WEB
Download
/ 2
Loading document…