Laser Measurement Solutions for Resin Processing and Molding

This document presents laser-based measurement solutions for resin processing and molding applications, focusing on increasing yield rates, improving quality, and reducing costs. It details various non-contact measurement systems (LK-G, LJ, LT, LS, LK-H Series) used for tasks such as measuring coating thickness, PCB mounting accuracy, gap and step of cellular phones, surface profile of molded parts, and diameter of extruded tubes.