Hygrothermal Aging of a Silica-Filled Epoxy Resin

This document investigates the effects of hygrothermal conditioning (80°C, 80% RH) on an epoxy resin filled with 60% silica flour, using weight measurements, thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The study reveals that filled samples exhibit continued mass uptake after apparent saturation, attributed to water-induced debonding at the filler-matrix interface and subsequent hydrolysis, leading to a degraded interphase region and reduced elastic modulus in the rubbery state.