50% (4) 1.5k views 8 pages

IC Package Inspection with 3D Optical Profilometer Guidebook

AI-enhanced description

This guidebook introduces technical information related to IC packages and example inspections using KEYENCE’s 3D Optical Profilometer. It covers typical IC package types, including insertion, surface mount, and matrix packages, and highlights applications such as warpage inspection with height color display and surface measurement.

Uploaded by FRANCESCA_108
Download
/ 8
Loading document…